1/5 STPS0530Z ? december 2002 - ed : 1a schottky rectifiers n very small conduction losses n negligible switching losses n extremely fast switching features and benefits single schottky rectifier suited for switch mode power supplies and high frequency dc to dc converters. packaged in sod-123, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. due to the small size of the package this device fits gsm and pcmcia requirements. description sod-123 symbol parameter value unit v rrm repetitive peak reverse voltage 30 v i f(rms) rms forward current 2 a i f(av) average forward current d =0.5 ta=55c 0.5 a i fsm surge non repetitive forward current tp=10ms sinusoidal 5.5 a dv/dt critical rate of rise of reverse voltage 10000 v/ m s t stg storage temperature range - 65 to + 125 c tj maximum operating junction temperature * 125 c tl maximum temperature for soldering during 10s 260 c absolute ratings (limiting values) *: dptot dtj rth j a < - 1 () thermal runaway condition for a diode on its own heatsink i f(av) 0.5 a v rrm 30 v v f (max) 0.33 v main product characteristics
STPS0530Z 2/5 symbol parameter tests conditions value unit STPS0530Z typ. max. i r * reverse leakage current tj = 25c v r =15v 12 m a tj = 125c 3 5 ma tj = 25c v r =v rrm 130 m a tj = 125c 9 21 ma v f ** forward voltage drop tj = 25c i f = 0.1 a 0.375 v tj = 125c 0.20 0.22 tj = 25c i f = 0.5 a 0.43 tj=125c 0.31 0.33 pulse test : * t p=5ms, d <2% ** tp = 380 m s, d <2% to evaluate the maximum conduction losses use the following equation : p=0.23xi f(av) +0.18xi f 2 (rms) static electrical characteristics symbol parameter value unit r th (j-a) junction to ambient 340 * c/w (*) copper area on pcb s = 2.5mm2 thermal resistance
STPS0530Z 3/5 0.00 0.02 0.04 0.06 0.08 0.10 0.12 0.14 0.16 0.18 0.20 0.22 0.0 0.1 0.2 0.3 0.4 0.5 0.6 i (a) f(av) t d =tp/t tp d = 0.05 d = 0.1 d = 0.2 d = 0.5 d = 1 p (w) f(av) fig. 1: conduction losses versus average current. 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0 25 50 75 100 125 tamb(c) r th(j-a) =340c/w s=2.5mm2 i (a) f(av) fig. 2: average forward current versus ambient temperature ( d = 0.5) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 1.e-03 1.e-02 1.e-01 1.e+00 t(s) t amb =25c t amb =75c t amb =50c t amb =50c i m t d =0.5 i (a) m fig. 3: non repetitive surge peak forward current versus overload duration (maximum values). 1.0e-03 1.0e-02 1.0e-01 1.0e+00 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 tp(s) d = 0.5 d = 0.2 d = 0.1 single pulse t d =tp/t tp zth(j-a)/rth(j-a) fig. 4: relative variation of thermal impedance junction to ambient versus pulse duration. 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 024681012141618202224262830 v (v) r t j =125c t j =25c t j =100c t j =75c t j =50c i (ma) r fig. 5: reverse leakage current versus reverse voltage applied (typical values). 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 0 25 50 75 100 125 tj(c) v r =30v i (ma) r fig. 6: reverse leakage current versus junction temperature (typical values).
STPS0530Z 4/5 10 100 1000 1 10 100 v (v) r f=1mhz v osc =30mv rms t j =25c c(pf) fig. 7: junction capacitance versus reverse volt- age applied (typical values). 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 v (v) fm t j =25c (maximum values) t j =125c (maximum values) t j =125c (maximum values) t j =125c (typical values) t j =125c (typical values) i (a) fm fig. 8: forward voltage drop versus forward cur- rent. 0 50 100 150 200 250 300 350 0 102030405060708090100 s(mm2) r (c/w) th(j-a) fig. 9: thermal resistance junction to ambient ver- sus copper surface under each lead (epoxy printed board fr4, cu=35m, typical values).
STPS0530Z 5/5 information furnished is believed to be accurate and reliable. however, stmicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectronics. specifications mentioned in this publication are subject to change without notice. this publication supersedes and replaces all information previously supplied. stmicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap- proval of stmicroelectronics. the st logo is a registered trademark of stmicroelectronics ? 2002 stmicroelectronics - printed in italy - all rights reserved. stmicroelectronics group of companies australia - brazil - canada - china - finland - france - germany hong kong - india - israel - italy - japan - malaysia - malta - morocco - singapore spain - sweden - switzerland - united kingdom - united states. http://www.st.com package mechanical data sod-123 h b d e a1 a2 a g c ref. dimensions millimeters inches min. max. min. max. a 1.45 0.057 a1 0 0.1 0 0.004 a2 0.85 1.35 0.033 0.053 b 0.55 typ. 0.022 typ. c 0.15 typ. 0.039 typ. d 2.55 2.85 0.1 0.112 e 1.4 1.7 0.055 0.067 g 0.25 0.01 h 3.55 3.95 0.14 0.156 type marking package weight base qty delivery mode STPS0530Z z53 sod-123 0.01g. 3000 tape & reel n epoxy meets ul94, v0. n band indicates cathode. marking 4.45 0.65 0.97 2.51 0.97 footprint (in millimeters)
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